Research
Core Areas
Circuit division
In 2018, more than 1.5 billion US dollars have been invested in AI Circuits from silicon valley. Big companies (Apple, Google, Samsung, Amazon, etc) are pouring even more money to develop Circuits for AI. Why? Because circuit is the biggest bottleneck in AI. The progress in AI cannot continue without the advancement of circuits that form the core foundation of neural networks and machine learning. Circuit is and will continue to be the hottest area in AI for the upcoming future.
![]() | http://nais.kaist.ac.kr |
![]() | Bae, Hyeonmin |
![]() | National Nano Fab Center (E19) |
![]() | Mixed mode IC design, High speed broadband communications |
![]() | http://ccs.kaist.ac.kr/ |
![]() | Cho, Seonghwan |
![]() | National Nano Fab Center (E19) |
![]() | Analog & Mixed signal integrated circuit design for communication, bio-application, and emerging technologies |
![]() | http://impact.kaist.ac.kr |
![]() | Je, Minkyu |
![]() | School of Electrical Engineering (E3-2) |
![]() | 센서 인터페이스 집적 회로, 무선 통신 집적 회로, 마이크로 시스템 융합 (의료기기, 사물인터넷, 웨어러블 응용) |
![]() | http://seed.kaist.ac.kr |
![]() | Jung, Wanyeong |
![]() | School of Electrical Engineering (E3-2) |
![]() | Ultra low-power analog/digital circuits and IoT systems |
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http://bongjin.com |
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Kim, Bongjin |
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School of Electrical Engineering (E3-2), 5226 |
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Digital VLSI circuit research, Next Generation Computing, Communication Circuit Design, Domain/application-specific hardware accelerators |
![]() | https://www.icdesignlab.net/ |
![]() | Kim, Hyun Sik |
![]() | School of Electrical Engineering (E3-2) |
![]() | Analog Integrated Circuit Design, Display Electronics, Power Conversion & Management IC, Readout IC |
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https://castlab.kaist.ac.kr |
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Kim, Joo-Young |
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School of Electrical Engineering (E3-2) |
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VLSI Design, Computer Architecture, FPGA, Hardware/Software Co-Design |
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http://mvlsi.kaist.ac.kr |
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Kim, Lee-Sup |
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School of Electrical Engineering (E3-2) |
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Multimedia VLSI Design, Low Power High Speed Circuit Design |
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https://sites.google.com/view/kwongroup |
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Kwon, Kyeongha |
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School of Electrical Engineering (E3-2) |
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Mixed-signal IC design for high-speed communication and biomedical applications |
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http://nice.kaist.ac.kr |
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Lee, Sang-Gug |
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School of Electrical Engineering (E3-2) |
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RF, Analog and mixed-mode circuits and systems design |
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http://ics.kaist.ac.kr |
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Park, In-Cheol |
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National Nano Fab Center (E19) |
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Digital Circuit Design, Digital VLSI Design and CAD |
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https://msicl.kaist.ac.kr/ |
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Ryu, Seung-Tak |
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School of Electrical Engineering (E3-2) |
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Analog/Mixed-mode Integrated Circuit Design |
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http://dtlab.kaist.ac.kr/ |
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Shin, Youngsoo |
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School of Electrical Engineering (E3-2), 6206 |
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Design Technology for VLSI and PIM, Computational Lithography
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![]() | http://ssl.kaist.ac.kr |
![]() | Yoo, Hoi-Jun |
![]() | School of Electrical Engineering (E3-2) |
![]() | System On Chip design, Healthcare system, Network On Chip with Humanistic processing |
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http://www.shinhyunlab.kaist.ac.kr/ |
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Choi, Shinhyun |
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School of Electrical Engineering (E3-2) |
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Neuromorphic Computing device and integrated system |
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http://www.ndsl.kaist.edu |
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Jung, Myoungsoo |
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Kim Beang-Ho KIM Sam-Youl ITC B/D (N1) |
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SSD Storage, Non-Volatile Memory, Computer Architecture, File and Operating Systems |
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https://sites.google.com/view/kaist-via |
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Rhu, Minsoo |
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Kim Beang-Ho KIM Sam-Youl ITC B/D (N1) |
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VIA (Vertically Integrated Computer Architecture) Research Group |
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http://rfss.kaist.ac.kr |
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Yu, Jong-Won |
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School of Electrical Engineering (E3-2) |
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RF Microelectronics, RF and Microwave System Integration |
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