{"id":182618,"date":"2024-12-30T17:58:50","date_gmt":"2024-12-30T08:58:50","guid":{"rendered":"http:\/\/ee.presscat.kr\/?post_type=research-achieve&p=182618"},"modified":"2026-04-13T07:08:13","modified_gmt":"2026-04-12T22:08:13","slug":"ieee-edaps-2024-best-paper-award-winner-taesoo-kim-master-student-from-prof-jeongho-kims-research-lab-tera-lab","status":"publish","type":"research-achieve","link":"http:\/\/ee.presscat.kr\/en\/research-achieve\/ieee-edaps-2024-best-paper-award-winner-taesoo-kim-master-student-from-prof-jeongho-kims-research-lab-tera-lab\/","title":{"rendered":"IEEE EDAPS 2024, Best Paper Award Winner Taesoo Kim, Master student from Prof. Jeongho Kim’s Research Lab (TERA LAB)"},"content":{"rendered":"
\"\uae40\ud0dc\uc218
< Master\u2019s candidate Taesoo Kim ><\/figcaption><\/figure>\n

 <\/p>\n

Master’s candidate Taesoo Kim from Professor Jeongho Kim\u2019s lab achieved remarkable success by winning the\u00a0Best Paper Award<\/strong>\u00a0at the ‘IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) 2024<\/strong>‘, held on December 17-19 at the Taj Yeshwantpur, in Bangalore, India.<\/span><\/p>\n

 <\/p>\n

The ‘IEEE\u00a0EDAPS’ is the largest and most influential conference on semiconductor packaging technology in the Asia-Pacific region. Since 2002, it has been annually organized and hosted by the IEEE Electronic Packaging Society.\u00a0<\/span><\/p>\n

 <\/p>\n

\"\ud559\ud68c\uc5d0\uc11c
< Taesoo Kim presenting at the EDAPS ><\/figcaption><\/figure>\n

 <\/p>\n

The award-winning paper, titled “Design and Analysis of Twin Tower High Bandwidth Memory (HBM) Architecture for Large Memory Capacity and High Bandwidth System,” was authored by mater’s student Taesoo Kim as the first author.\u00a0<\/span><\/p>\n

 <\/p>\n

This paper received high acclaim for its creativity, completeness and future scalability. In particular, the innovative concept of implementing the “Twin Tower” structure to effectively address the limitations of traditional memory designs, and the ability to present a new direction in memory architecture for supporting ultra-large AI models, were recognized and led to the prestigious Best Paper Award.<\/span><\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

633<\/p>\n","protected":false},"featured_media":182616,"template":"","research_category":[353],"class_list":["post-182618","research-achieve","type-research-achieve","status-publish","has-post-thumbnail","hentry","research_category-integrated-circuits-semiconductor-systems-en"],"acf":[],"_links":{"self":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/research-achieve\/182618","targetHints":{"allow":["GET"]}}],"collection":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/research-achieve"}],"about":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/types\/research-achieve"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/media\/182616"}],"wp:attachment":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/media?parent=182618"}],"wp:term":[{"taxonomy":"research_category","embeddable":true,"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/research_category?post=182618"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}