{"id":117978,"date":"2020-12-23T10:51:39","date_gmt":"2020-12-23T01:51:39","guid":{"rendered":"http:\/\/175.125.95.178\/research-achieve\/17978\/"},"modified":"2026-04-13T23:55:43","modified_gmt":"2026-04-13T14:55:43","slug":"17978","status":"publish","type":"research-achieve","link":"http:\/\/ee.presscat.kr\/en\/research-achieve\/17978\/","title":{"rendered":"Professor Joungho Kim\u2019s lab Ph.D candidate Kyungjune Son is Rewarded 2020 IEEE EDAPS Best Student Paper Award"},"content":{"rendered":"<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Our department\u2019s professor Joungho&nbsp;Kim\u2019s lab Ph.D candidate Kyungjune Son has received the Best Student Paper Award from EDAPS.<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Due to COVID-19, the conference was held online from December 14 to 16.<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>The EDAPS is an annually held IEEE international conference.<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Details are as below.<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Conference name : 2020 IEEE International Conference on Electrical Design of Advanced Packaging and System<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Period : December 14-16<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Award : Best Student Paper Award<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Author : Kyungjune Son, et al., Joungho Kim (PI)<\/span><\/span><\/span><\/p>\n<p style=\"text-align:justify;margin-bottom:11px\"><span style=\"font-size:10pt\"><span style=\"line-height:107%\"><span>Title : Deep Reinforcement Learning-based Interconnection Design for 3D W-Point Array Structure Considering Signal Integrity<\/span><\/span><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>729<\/p>\n","protected":false},"featured_media":126398,"template":"","research_category":[],"class_list":["post-117978","research-achieve","type-research-achieve","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/research-achieve\/117978","targetHints":{"allow":["GET"]}}],"collection":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/research-achieve"}],"about":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/types\/research-achieve"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/media\/126398"}],"wp:attachment":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/media?parent=117978"}],"wp:term":[{"taxonomy":"research_category","embeddable":true,"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/research_category?post=117978"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}