{"id":107302,"date":"2009-11-30T13:59:48","date_gmt":"2009-11-30T04:59:48","guid":{"rendered":"http:\/\/175.125.95.178\/press\/7302\/"},"modified":"2026-04-18T07:04:34","modified_gmt":"2026-04-17T22:04:34","slug":"7302","status":"publish","type":"press-post","link":"http:\/\/ee.presscat.kr\/en\/presses\/7302\/","title":{"rendered":"EPEPS 2009, Best Student Paper Award"},"content":{"rendered":"<table cellspacing=\"1\" cellpadding=\"1\" width=\"664\" border=\"0\" style=\"width: 664px;height: 147px\">\n<tbody>\n<tr>\n<td><img decoding=\"async\" height=\"172\" alt=\"\" width=\"130\" src=\"\/userfiles\/2009_10_21 Kim Joohee.png\" title=\"\"><\/td>\n<td>\n<p>The graduate student of our department EE, Joohee Kim (MS) (Advisor: Jungho Kim), <br \/>\n            won the best student paper award at EPEPS 2009 (18th Electrical Performance of <br \/>\n            Electronic Pachaging and Systems)<\/p>\n<p>\n            Title: Through Silicon Via (TSV) Equalizer<br \/>\n            2009\/10\/21, Embassy Suites, Portland (Tigard), Oregon<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p><img fetchpriority=\"high\" decoding=\"async\" height=\"278\" alt=\"\" width=\"500\" src=\"\/userfiles\/2009_10_21 EPEPS2009(3).jpg\" title=\"\"><\/p>\n","protected":false},"excerpt":{"rendered":"<p>565<\/p>\n","protected":false},"featured_media":0,"template":"","class_list":["post-107302","press-post","type-press-post","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/press-post\/107302","targetHints":{"allow":["GET"]}}],"collection":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/press-post"}],"about":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/types\/press-post"}],"wp:attachment":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/media?parent=107302"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}