{"id":132867,"date":"2022-06-16T10:15:13","date_gmt":"2022-06-16T01:15:13","guid":{"rendered":"http:\/\/192.249.19.202\/?post_type=ai-in-device&p=132867"},"modified":"2026-04-13T03:37:46","modified_gmt":"2026-04-12T18:37:46","slug":"ee-professor-kim-sanghyeons-team-develop-3d-stackable-quantum-computing-readout-device","status":"publish","type":"ai-in-device","link":"http:\/\/ee.presscat.kr\/en\/ai-in-device\/ee-professor-kim-sanghyeons-team-develop-3d-stackable-quantum-computing-readout-device\/","title":{"rendered":"EE Professor Kim, SangHyeon\u2019s team develop 3D Stackable Quantum Computing Readout Device"},"content":{"rendered":"

Title: \u00a0EE Professor Kim, SangHyeon\u2019s Research Team Develops 3D Stackable Quantum Computing Readout Device<\/strong><\/span><\/p>\n

KAIST Builds 3D Stackable Quantum Computing Readout Device\u00a0\u00a0Low-power, low-noise, high-speed device integrated in 3D operates at super-low temperatures and promises large-scale applications to quantum computing devices.<\/span><\/p>\n

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<(From left) EE Prof. Kim, SangHyeon, PhD candidate Jeong, Jae Yong, NanoFab PhD candidate Kim, Jongmin, and KBSI Prof. Park, Seung-Young><\/span><\/p>\n

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KAIST EE Prof. Kim, SangHyeon\u2019s research team has developed a 3D-stacked semiconductor readout device integration technology, as made public on the 16th. The team made this possible by applying the strengths of monolithic 3D integration to overcome large-scale qubit implementation based on existing quantum computing systems. Their work is a first of its kind exhibiting the 3D stackability of quantum computing readout devices after an actively pursued line of research on monolithic 3D stacking of high-speed devices following a 2021 VLSI presentation, a 2021 IEDM presentation, and a 2022 ACS Nano publication.<\/span><\/p>\n

(*monolithic 3D integration: dubbed the ultimate 3D integration tech, wherein after the lower-layer devices, the upper layer\u2019s thin film is created and stacking proceeds sequentially so as to maximize the upper-lower device alignment)<\/span><\/p>\n

KAIST EE Prof. Kim, SangHyeon Kim\u2019s research team member Jeong, Jae Yong led the work as first author, collaborating with NanoFab PhD candidate Kim, Jongmin and KBSI Prof. Park, Seung-Young. Their joint work has been presented at the \u201csemiconductor Olympics\u201d, Symposium on VLSI Technology. (Paper: 3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing system)<\/span><\/p>\n

A qubit is capable of processing twice the amount computation compared with that of a bit. Number of qubits increasing linearly results in exponential speedup of their computation. Thus, developing large-scale quantum computing is of utmost importance. IBM, for instance, presented Eagle containing 127 qubits, and the IBM roadmap outlines development of a 4,000-qubit quantum computer by 2025 and one with 10,000-qubits or more in 10 years.<\/span><\/p>\n

Designing such large-scale quantum computers with many qubits requires implementing devices for qubit control\/readout. The research team has not only proposed and implemented 3D-stacked control\/readout devices but also achieved world-best cutoff frequency characteristics at cryogenic settings despite the 3D stacking.<\/span><\/p>\n

This work has been supported by the National Research Foundation of Korea, the System Semiconductor Development Program funded by Gyeonggi-do, and the Korea Basic Science Institute.<\/span><\/p>\n

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