{"id":116925,"date":"2017-11-15T00:00:00","date_gmt":"2017-11-14T15:00:00","guid":{"rendered":"http:\/\/175.125.95.178\/ai-in-device\/16925\/"},"modified":"2026-05-03T04:59:38","modified_gmt":"2026-05-02T19:59:38","slug":"16925","status":"publish","type":"ai-in-device","link":"http:\/\/ee.presscat.kr\/en\/ai-in-device\/16925\/","title":{"rendered":"Professors Yang-Kyu Choi &amp; Sung-Yool Choi\u2019s research group develops wearable logic in-memory circuitry on commercial fabric"},"content":{"rendered":"<p>Professors&nbsp;Yang-Kyu Choi &amp; Sung-Yool Choi\u2019s research group were reported in Etnews about the wearable logic-in-memory using memristor on February 10th, 2018.<\/p>\n<p>The research develops a wearable logic-in-memory based on memristors by weaving a special thread coated with electrode and polymer insulating layer.<\/p>\n<p>The study was published in the October 2017 issue of the international journal &#8220;Nano Letters.&#8221; (Impact factor 2017 : 12.080)<\/p>\n<p>&nbsp;<\/p>\n<p>Media: \u2018KAIST, implementing storage and computation device by weaving the thread\u2026 Implementing new concept of the wearable device\u2019<\/p>\n<p><a href=\"http:\/\/www.etnews.com\/20180328000205\" rel=\"noopener\">http:\/\/www.etnews.com\/20180328000205<\/a><\/p>\n<p>KAIST EE: \u2018Research by Ph.D candidate Bae, Hak-Yeol and Jang, Byung-Cheol has been published in Nano Letters&#8217;<\/p>\n<p><a href=\"http:\/\/ee.presscat.kr\/en\/research-achieve\/15452\/\">http:\/\/ee.presscat.kr\/en\/research-achieve\/15452\/<\/a><\/p>\n<p>&nbsp;<\/p>\n<p><strong>Article title: Functional Circuitry on Commercial Fabric via Textile-Compatible Nanoscale Film Coating Process for Fibertronics<\/strong><\/p>\n<p>A research article authored by Hagyoul Bae (KAIST EE), Byung Chul Jang (KAIST EE), Hongkeun Park (KAIST CBE), Soo-Ho Jung (KIMS), Hye Moon Lee (KIMS), Jun-Young Park (KAIST EE), Seung-Bae Jeon (KAIST EE), Gyeongho Son (KAIST EE), Il-Woong Tcho (KAIST EE), Kyoungsik Yu (KAIST EE), Sung Gap Im (KAIST CBE), Sung-Yool Choi (KAIST EE; Corresponding author), and Yang-Kyu Choi (KAIST EE; Corresponding author) was published in <em>Nano Letters<\/em> (2017.10)<\/p>\n<p>Fabric-based electronic textiles (e-textiles) are the fundamental components of wearable electronic systems, which can provide convenient hand-free access to computer and electronics applications. However, e-textile technologies presently face significant technical challenges. These challenges include difficulties of fabrication due to the delicate nature of the materials, and limited operating time, a consequence of the conventional normally on computing architecture, with volatile power-hungry electronic components, and modest battery storage. Here, we report a novel poly(ethylene glycol dimethacrylate) (pEGDMA)-textile memristive nonvolatile logic-in-memory circuit, enabling normally off computing, that can overcome those challenges. To form the metal electrode and resistive switching layer, strands of cotton yarn were coated with aluminum (Al) using a solution dip coating method, and the pEGDMA was conformally applied using an initiated chemical vapor deposition process. The intersection of two Al\/pEGDMA coated yarns becomes a unit memristor in the lattice structure. The pEGDMA-Textile Memristor (ETM), a form of crossbar array, was interwoven using a grid of Al\/pEGDMA coated yarns and untreated yarns. The former were employed in the active memristor and the latter suppressed cell-to-cell disturbance. We experimentally demonstrated for the first time that the basic Boolean functions, including a half adder as well as NOT, NOR, OR, AND, and NAND logic gates, are successfully implemented with the ETM crossbar array on a fabric substrate. This research may represent a breakthrough development for practical wearable and smart fibertronics.<\/p>\n<p><img decoding=\"async\" alt=\"\" class=\"media-element file-default\" data-delta=\"1\" data-fid=\"6868\" data-media-element=\"1\" src=\"http:\/\/ee.presscat.kr\/sites\/default\/files\/%EC%B5%9C%EC%96%91%EA%B7%9C%20%EA%B5%90%EC%88%98%EB%8B%98%20%EC%96%B8%EB%A1%A0%EB%B3%B4%EB%8F%84_1.png\" title=\"\"><\/p>\n<p><strong>Figure 1.<\/strong> <strong>A<\/strong> Conceptual image of the fabricated memory device based on the cross-linked Al\/pEGDMA-coated yarns. <strong>B<\/strong> Bipolar I\u2212V characteristic of the fabricated ETM array on the cotton substrate with a pEGDMA film thickness of 60 nm. The inset shows the optical microscope image of the fabricated ETM array and the schematic image of the Al\/pEGDMA-coated yarn. <strong>C<\/strong> Schematic view of the formation of a conductive carbon filament bridging of TE and BE via the pEGDMA. <strong>D<\/strong> Schematic of the logic-in-memory operations of NOR and NOT gates and their equivalent circuits within the crossbar array via the MAGIC architecture. The inset presents a conceptual image for integration of each logic gate on the fabric. <strong>E<\/strong> Experimental results of the MAGIC-NOR gate. <strong>F<\/strong> Experimental results of the MAGIC-NOT gate.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>826<\/p>\n","protected":false},"featured_media":126825,"template":"","class_list":["post-116925","ai-in-device","type-ai-in-device","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/ai-in-device\/116925","targetHints":{"allow":["GET"]}}],"collection":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/ai-in-device"}],"about":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/types\/ai-in-device"}],"wp:featuredmedia":[{"embeddable":true,"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/media\/126825"}],"wp:attachment":[{"href":"http:\/\/ee.presscat.kr\/en\/wp-json\/wp\/v2\/media?parent=116925"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}